Manufacturing Printed Electronics 2023-2033

Manufacturing Printed Electronics 2023-2033 explores the developments, transitions, and technological innovations within the printed electronics equipment market. Drawing on interviews and interactions with over 40 companies, we assess the attributes, readiness level, use cases and market demand for three classes of analogue printing and five classes of digital printing (throughput, minimum feature size and compatible ink viscosity of these competing technologies is clearly outlined). The report also covers vacuum deposition, additive circuit prototyping (both 2D and 3D) and mounting components - a critical step in the production of flexible hybrid electronics. Furthermore, the motivation, challenges and facilitating technologies associated with the transition towards roll-to-roll R2R electronics manufacturing are comprehensively covered.

 

Drawing on IDTechEx's comprehensive coverage of current and emerging applications across the printed/flexible electronics market, the report provides over 50 distinct forecast lines with each manufacturing methodology further segmented by application. Primary insight from interviews and interactions with individual players, ranging from established players to innovative start-ups, is included via over 40 detailed company profiles that include discussion of both technology and business model along with SWOT analysis. Overall, the report provides a comprehensive view of trends and competing technologies with printed/flexible electronics.

 

 

Compatibility with rapid roll-to-roll (R2R) manufacturing is commonly cited as a key value proposition of printed/flexible electronics. By printing the functionality onto flexible substrates, rather than etching copper from rigid substrates, similar manufacturing methods (and hence throughputs) as conventional graphics printing can be achieved. With such high throughputs the fixed cost of the production equipment can be shared across many more circuits, meaning that the total production cost is dominated by the materials used. As such R2R electronics manufacturing is seen as an important facilitator of ubiquitous electronics, which will enable technologies such as smart packaging and electronic skin patches to be produced cost-effectively. Furthermore, the high throughput of R2R electronics is ideally suited for producing large area devices such as photovoltaic panels and lighting.

 

However, thus far most R2R electronics manufacturing (RFID excepted) has remained confined to research centers and pilot lines. Some of the challenges associated with adopting R2R electronics manufacturing include establishing sufficient order volume, quality control, and component attachment. The report explores these issues, and outlines emerging technological solutions such as high throughput digital printing, contactless in-line conductivity measurement, and photonic soldering.

 

 

 

Screen printing currently dominates printed electronics manufacturing, due to its compatibility with high viscosity flake-based conductive inks that enable thick traces to be deposited in a single pass. Furthermore, the resolution (i.e., minimum feature size) that screen printing can achieve has been steadily increasing with the development of finder meshes. However, it is far from the only deposition option.

 

While many conventional analogue graphics printing methods (such as flexography) can be applied to printed/flexible electronics, much of the innovation is within digital deposition methods that enable rapid prototyping and facilitate high mix low volume manufacturing (HMLV). Especially notable is laser induced forward transfer (LIFT), which can be regarded as combining the benefits of inkjet, screen printing and laser direct structuring. This digital method can handle viscous inks, has a high throughput (being optically driven), and can even be used on non-planar surfaces since it is a non-contact method.

 

Other emerging printing methods aim to bring additive digital manufacturing to length scales currently achieved with subtractive methods. Electrohydrodynamic (EHD) printing, in which traces as narrow as 1 um are produced using an electric field, is gradually gaining commercial traction for prototyping and repairs. Furthermore, multiple companies are developing multi-nozzle systems using MEMS (micro electromechanical systems) printheads to somewhat break the longstanding trade-off between throughput and viscosity.

 

It is an exciting time for printed/flexible electronics, with multiple products (such as backlit capacitive touch sensors in cars) reaching significant commercial adoption over the last year. However, arguably the most compelling growth opportunities are for applications facilitated by printed/flexible electronics, since conventional electronics is either too expensive, too rigid, or both. Electronic skin patches for continuous health monitoring and smart packaging are great examples but will need high throughput R2R manufacturing to produce the flexible circuitry at an acceptable price point. At much smaller length scales, aerosol printing is gaining commercial traction in advanced semiconductor packaging, while increasing the throughput of very high resolution EHD printing will open up new applications in this space and others such as microfluidics.

 

 

 

IDTechEx has 20 years of expertise covering printed and flexible electronics, including printing and manufacturing methods. Our analysts have closely followed the latest developments in the technology and associated markets by interviewing many equipment suppliers and product developers, along with annually attending multiple printed electronics conferences such as LOPEC and FLEX. This report provides a comprehensive picture of the manufacturing landscape for this emerging technology, helping to support choices in product development and when scaling up to mass production

 

This report provides the following information:

 

Technology trends & manufacturer analysis:

 

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