導電性接着剤 2022-2032年: 技術、市場および見通し

1. 全体概要

2. イントロダクション

　i. 導電性接着剤とは？

　ii. 市場分析

　iii. ECA の用途の概要

　iv. ECA の材料と特性の概要

　v. 導電性接合技術の概要

3. 等方性と異方性の導電性技術

　i. 等方性導電性接着剤（ICA）

　ii. 異方性導電性接着剤（ACA）

4. 導電性充填剤

　i. 導電性充填剤に必要とされる特性

　ii. 充填剤の材料の選択肢

　iii. 充填剤の材料の形態

5. 構造用樹脂

　i. 樹脂材料に必要とされる特性

　ii. 樹脂の材料の選択肢

6. ECA の活用: 段階別プロセス

　i. ECA の応用技術

　ii. ECA の硬化

　iii. ECA の貯蔵

　iv. 部品デザインおよび ECA によるテスト

　v. ECA の不具合対応

7. ECA の最先端技術

　i. ICA の最先端技術

　ii. ACF の最先端技術

　iii. ACP の最先端技術

8. ECA の用途

　i. 消費家電

　ii. 自動車用エレクトロニクス

　iii. 航空用エレクトロニクス

　iv. ディスプレイ

　v. EMI シールド

　vi. 太陽電池

　vii. プリンテッドおよびフレキシブルエレクトロニクス

　viii.ウェアラブル

　ix. RFID

　x. インモールドエレクトロニクス

9. 市場見通し

 

●　導電性接着剤の競合技術（およびその他の導電性接合技術）

●　導電性接着剤に関係する技術

●　サプライヤーのタイプに関する分析

●　導電性接着剤の最先端技術

●　ECA の主な材料特性

●　主な用途分野と業界

●　ECA の使用事例の分析

●　市場見通しおよび分析

-10種の用途分野別の10年先の詳細な市場見通し

-ECA のタイプ別の10年先市場見通し: ICA、ACP および ACF

-ECA のタイプ別のそれぞれの用途分野の10年先見通し

 

Electrically conductive adhesives (ECAs) are set to become a key conductive joining technology across a range of emerging industries. They may be used to connect components and circuitry across a wide range of uses, giving joins which are mechanically strong and electrically conductive. Due to the restricted use of lead-based solders, new alternatives are needed to fill the gap in the market, and IDTechEx believes electrically conductive adhesives are one of the most promising options.

 

Additionally, ECAs provide other benefits, such as fine pitch capacity, required for miniaturisation of electronics, and low temperature joining. Although they do have drawbacks, these benefits make ECAs well positioned to become the dominant joining technology in several emerging applications such as flexible, printable, and in-mold electronics.

 

 

 

The report analyses both current and emerging applications of ECAs, considering the key drivers and requirements for these areas, including automotive electronics, consumer electronics, display applications, printed electronics, and RFID applications.10-year market forecasts are given for each application area, broken down both by application, and by the type of adhesives used. Key players are evaluated, including Henkel, Panacol, Dexerials, Showa Denko Materials, and others.

 

Electrically conductive adhesives are made of two components: the conductive filler, and the structural resin. The filler creates the conductive link across a join. Fillers are typically metal based, with the most common metal being silver. The resin provides mechanical strength to the adhesives and holds the filler particles in place. Resins are generally polymer based, with epoxy being the most common option. In this report, IDTechEx discusses established and emerging fillers and resins, analysing commercially available adhesives, and providing a detailed breakdown of commercially available ECAs. The exact properties desired from both the filler and the resin are also discussed, and different materials are evaluated for suitability.

 

The current state of the ECA industry technology and areas of innovation are also considered. Several novel ECA products are investigated, and areas of R&D pursued by market leading suppliers are highlighted.

 

Some key benefits of using an ECA are the fine pitch capacity, the low processing temperature, and the high flexibilities which can be achieved. These benefits make ECAs well suited to making smaller electronics and allow for use on a wider variety of substrates than alternative technologies, such as lead-free solders and silver sintering. Driven by these benefits, IDTechEx forecasts that the market for ECAs is growing, with ECAs set to replace outdated and poor performing competitors across a range of applications, including displays, consumer electronics and wearable technology.

 

ECAs are not a perfect technology, however. Drawbacks include high costs compared with other joining technologies, primarily due to high materials and processing costs, as well as a lack of self-alignment for components. This can make them unsuitable for certain applications, such as cost-sensitive applications where fine pitch is not required, or applications where ease of repair is desirable, such as hobbyist use. It is likely that no single conductive joining technology will win out in future, although IDTechEx believes that ECAs will become increasingly important over the next decade.

 

 

ECAs are used across a range of established and emerging applications. Markets for established applications are more likely to grow at a steady rate, whereas emerging technologies that currently represent a comparatively small market may have the potential for much more rapid growth.

 

Current and future applications and markets considered in this report include:

 

With 10-year market forecasts, key specifications, and SWOT analyses, provided for each application.

 

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アイディーテックエックス株式会社 (IDTechEx日本法人)

電話 03-3216-7209

担当: 村越美和子 m.murakoshi@idtechex.com