3D 电子设备/增材电子设备 2022-2032
This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics, saving space, weight and reducing manufacturing complexity. It covers electronic functionality to 3D surfaces, in-mold electronics (IME), and fully 3D printed electronics. Also included are market forecasts, company profiles, readiness level assessments, case studies, and identification of technological challenges/opportunities, thus providing a clear picture of the emerging 3D / additive electronics landscape.
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