All IDTechEx Research reports : Semiconductors, Computing & AI

6G, sub-THz, 6G technology benchmarking, Non-Terrestrial Networks (NTN), LEO, Reconfigurable Intelligent Surface (RIS), cell-free massive MIMO, THz components, low-loss materials, packaging, heterogeneous integration, player landscape

Heterogeneous Integration, AI, High Performance Computing (HPC), Data Centers, Autonomous Vehicles, 5G, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL

Technology analysis and market forecasts for the global sale of AI chips by geography, processing type, architecture, packaging, application, and industry vertical, in addition to calculations for the costs associated with leading-edge AI chips.

Technology analyses and market forecasts for the global sale of AI chips for edge applications by geography, architecture, packaging, end-user, application, and industry vertical.

Artificial intelligence (machine learning and deep learning) in virtual screening, de novo drug design, lead optimization, and chemical synthesis planning.

Benchmarking 60+ companies for image recognition AI performance, market readiness, value proposition, technical maturity and more. Granular forecasts for 12 clinical applications, insights into addressable market size and penetration until 2030.

AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming

Adoption of radar enabled ADAS functions, new radar technologies, emergence of 4D imaging radar, imaging radar benchmarking, automotive radar market forecast, leading tier 1 and tier 2 products, radar tier 1 supplier market share.

Telehealth, telemedicine, remote patient monitoring, consumer health wearables, digital therapeutics, & artificial intelligence in medical diagnostics

Global demands, market trends and market forecasts for electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs).

Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.

Covering applications such as wearable electronics, prototyping automotive electronics, and smart packaging, along with underlying technologies including conductive inks, flexible ICs, component attachment materials/methods and R2R manufacturing.

2.5D, 3D, advanced semiconductor packaging, RDL, dielectric material, Cu-Cu hybrid bonding, EMC, MUF

Data-centric approaches for design and discovery within materials science. Notable advancements in data infrastructures, machine learning, and AI. Player profiles, technology progression, market outlook, strategic approaches.

Covering tandem, thin-film, flexible, and building-integrated perovskite solar cells, along with perovskite LEDs, sensors and photodetectors

Quantum random number generators, quantum key distribution, terrestrial optical networks and space-based satellite quantum networks for the next generation of cryptographic security

Market analysis of hardware enabling quantum computing. Includes twenty-year quantum computing market forecasts, with superconducting, photonic, silicon-spin, neutral-atom, trapped-ion, diamond defect, topological, and annealing categories.

Atomic clocks, quantum gyroscopes, quantum magnetic field sensors, quantum gravimeters and quantum image sensors. Technology landscapes, market players, granular quantum sensor market forecasts and interview-based company profiles.

Design, Manufacture and Packaging of Photonic Chips in Silicon, Indium Phosphide, Silicon Nitride, Glass, Polymer, Thin-Film Lithium Niobate, and other III-V

Semiconductor materials trends within electric and autonomous vehicles, battery management system (BMS), microcontrollers (MCU), Systems on chips (SoCs), ADAS, LiDAR, radar, 5G connectivity. Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC).

Covering sustainable, green electronics, materials and manufacturing, integrated circuits, printed circuit boards, PCBs, printed, flexible, and hybrid electronics.

Sub-6 GHz and mmWave 5G in infrastructure and smartphones. Antenna developments, mMIMO, power amplifiers, semiconductor technologies, die attach materials and thermal interface materials.

Air Cooling, Liquid Cooling, Direct-to-Chip/Cold Plate Cooling, Immersion Cooling, Single-Phase and Two-Phase Cooling, Coolant Distribution Units (CDU), Pumps, and Hyperscale Data Centers.

Covering emerging thin film photovoltaics, perovskites, organics, dye sensitized, cadmium telluride, copper indium gallium selenide, gallium arsenide, amorphous silicon, copper zinc tin sulfide, all-perovskite tandem, and perovskite on silicon tandem