1. | EXECUTIVE SUMMARY |
1.1. | 5G, next generation cellular communications network |
1.2. | Two types of 5G: Sub-6 GHz and mmWave |
1.3. | Summary: Global trends and new opportunities in 5G/6G |
1.4. | Updates on mmWave 5G deployment by region |
1.5. | Updates on mmWave 5G deployment by region |
1.6. | New opportunities for low-loss materials in mmWave 5G |
1.7. | Low-loss materials for 5G/6G discussed in this report |
1.8. | Applications of low-loss materials in semiconductor and electronics packaging |
1.9. | Evolution of low-loss materials used in different applications |
1.10. | Evolution of organic PCB materials for 5G |
1.11. | Benchmark of commercial low-loss organic laminates @ 10 GHz |
1.12. | Benchmark of LTCC and glass materials |
1.13. | Benchmarking of commercial low-loss materials for 5G PCBs/components |
1.14. | Status and outlook of commercial low-loss materials for 5G PCBs/components |
1.15. | Key low-loss materials supplier landscape |
1.16. | Packaging trends for 5G and 6G connectivity |
1.17. | Packaging trends for 5G and 6G connectivity |
1.18. | Benchmark of low loss materials for AiP |
1.19. | Overview: Redistribution layers in advanced semiconductor packages for 5G smartphones |
1.20. | IDTechEx outlook of low-loss materials for 6G |
1.21. | Forecast of low-loss materials for 5G: Area and revenue |
1.22. | Forecast of low-loss materials for 5G segmented by frequency |
1.23. | Forecast of low-loss materials for 5G segmented by material type: Revenue and area |
1.24. | Market discussion: Low-loss materials for 5G base stations |
1.25. | Market discussion: Low-loss materials for 5G |
1.26. | Market discussion: Low-loss materials for 5G smartphone antennas |
1.27. | Market discussion: Low-loss materials for 5G CPEs |
1.28. | Conclusions |
2. | INTRODUCTION |
2.1. | Terms and definitions |
2.1.1. | IDTechEx definitions of "substrate" |
2.1.2. | IDTechEx definitions of "package" |
2.1.3. | Glossary of abbreviations |
2.2. | Introduction to 5G |
2.2.1. | Evolution of mobile communications |
2.2.2. | 5G commercial/pre-commercial services (2022) |
2.2.3. | 5G, next generation cellular communications network |
2.2.4. | 5G standardization roadmap |
2.2.5. | Two types of 5G: Sub-6 GHz and mmWave |
2.2.6. | 5G network deployment strategy |
2.2.7. | Low, mid-band 5G is often the operator's first choice to provide 5G national coverage |
2.2.8. | Approaches to overcome the challenges of 5G limited coverage |
2.2.9. | 5G Commercial/Pre-commercial Services by Frequency |
2.2.10. | 5G mmWave commercial/pre-commercial services (Sep. 2022) |
2.2.11. | Mobile private networks landscape - By frequency |
2.2.12. | Updates on mmWave 5G deployment by region |
2.2.13. | Updates on mmWave 5G deployment by region |
2.2.14. | The main technique innovations in 5G |
2.2.15. | 5G for mobile consumers market overview |
2.2.16. | 5G for industries overview |
2.2.17. | 5G supply chain overview |
2.2.18. | 5G user equipment player landscape |
2.2.19. | 5G for home: Fixed wireless access (FWA) |
2.2.20. | 5G Customer Premise Equipment (CPE) |
2.2.21. | Summary: Global trends and new opportunities in 5G |
2.3. | Introduction to low-loss materials for 5G |
2.3.1. | Overview of challenges, trends, and innovations for high frequency 5G devices |
2.3.2. | New opportunities for low-loss materials in mmWave 5G |
2.3.3. | Applications of low-loss materials in semiconductor and electronics packaging |
2.3.4. | Anatomy of a copper clad laminate |
2.3.5. | Applications of low-loss materials: Beamforming system in 5G base station |
2.3.6. | Applications of low-loss materials: PCBs in 5G CPEs |
2.3.7. | Applications for low-loss materials: mmWave 5G antenna module for smartphones |
2.3.8. | Applications for low-loss materials: Semiconductor packages |
2.3.9. | Roadmap of Df/Dk development across all packaging materials for mmWave 5G |
3. | LOW-LOSS MATERIALS AT THE PRINTED CIRCUIT BOARD (PCB) AND COMPONENT LEVEL |
3.1. | Introduction |
3.1.1. | Overview of low-loss materials for PCBs and semiconductor packages |
3.1.2. | Five important metrics impacting low-loss materials selection |
3.2. | Low-loss organic laminate overview |
3.2.1. | Electric properties of common polymers |
3.2.2. | Thermoplastics vs thermosets |
3.2.3. | Thermoplastics vs thermosets for 5G |
3.2.4. | Evolution of organic PCB materials for 5G |
3.2.5. | Innovation trends for organic high frequency laminate materials |
3.2.6. | Hybrid system: Cost reduction for high frequency circuit boards |
3.2.7. | Key suppliers for high frequency and high-speed copper clad laminate |
3.2.8. | Benchmark of commercialised low-loss organic laminates |
3.2.9. | Benchmark of commercial low-loss organic laminates @ 10 GHz |
3.2.10. | Other examples of low-loss laminates |
3.3. | Low-loss thermosets |
3.3.1. | Strategies to achieve lower dielectric loss and trade-offs |
3.3.2. | Factors affecting dielectric loss: Polarizability and molar volume |
3.3.3. | Factors affecting dielectric loss: curing temperature |
3.3.4. | Strategies to reduce Dk and Df: Low polarity functional groups or atomic bonds |
3.3.5. | Strategies to reduce Dk and Df: Additives |
3.3.6. | Strategies to reduce Dk: Bulky structures |
3.3.7. | Strategies to reduce Dk: Porous structures |
3.3.8. | Strategies to reduce Df: Rigid structures |
3.3.9. | Where is the limit of Dk for modified thermosets? |
3.3.10. | The influence of Dk and substrate choice on PCB feature size |
3.3.11. | The challenge of thinning the PCB-substrate for high frequency applications |
3.3.12. | Low-loss thermoset suppliers: Ajinomoto Group's Ajinomoto Build Up Film (ABF) |
3.3.13. | Low-loss thermoset suppliers: Taiyo Ink's epoxy-based build-up materials |
3.3.14. | Low-loss thermoset suppliers: Taiyo Ink's epoxy-based build-up materials |
3.3.15. | Low-loss thermoset suppliers: DuPont's Pyralux laminates |
3.3.16. | Low-loss thermoset suppliers: Laird's ECCOSTOCK |
3.3.17. | Low-loss thermoset suppliers: Panasonic's R5410 |
3.3.18. | Low-loss thermoset suppliers: JSR Corp's aromatic polyether (HC polymer) |
3.3.19. | Low-loss thermoset suppliers: Showa Denko's polycyclic thermoset |
3.3.20. | Low-loss thermoset laminate suppliers: Mitsubishi Gas Chemical's BT laminate |
3.3.21. | Low-loss thermoset laminate suppliers: Isola |
3.3.22. | Low-loss thermoset laminate suppliers: Isola |
3.4. | Low-loss thermoplastics: Liquid crystal polymers |
3.4.1. | Liquid crystal polymers (LCP) |
3.4.2. | LCP classification |
3.4.3. | LCP antennas in smartphones and FPCBs |
3.4.4. | Liquid crystal polymer supply chain |
3.4.5. | Liquid crystal polymer supply chain for printed circuit boards: Companies |
3.4.6. | LCP types and key suppliers |
3.4.7. | LCP as an alternative to PI for flexible printed circuit boards |
3.4.8. | LCP vs PI: Dk and Df |
3.4.9. | LCP vs PI: Moisture |
3.4.10. | LCP vs PI: Flexibility |
3.4.11. | LCP vs MPI: Cost |
3.4.12. | LCP vs MPI: FCCL signal loss |
3.4.13. | Commercial LCP and LCP-FCCL products |
3.4.14. | Next-generation materials for smartphone antennas |
3.4.15. | Evolution of smartphone antennas from 2G to mmWave 5G |
3.4.16. | LCP product suppliers: Murata's MetroCirc antennas for smartphones |
3.4.17. | LCP product suppliers: Career Technology |
3.4.18. | LCP product suppliers: Avary/ZDT |
3.4.19. | LCP product suppliers: KGK (Kyodo Giken Kagaku) |
3.4.20. | LCP product suppliers: SYTECH's LCP-FCCL for mmWave 5G applications |
3.4.21. | LCP product suppliers: iQLP |
3.4.22. | LCP product suppliers: IQLP and DuPont's LCP-PCB |
3.5. | Thermoplastic polymer: PTFE |
3.5.1. | An introduction to fluoropolymers and PTFE |
3.5.2. | Key properties of PTFE to consider for 5G applications |
3.5.3. | Effect of crystallinity on the dielectric properties of PTFE-based laminates |
3.5.4. | Key applications of PTFE in 5G |
3.5.5. | Hybrid couplers using PTFE as a substrate |
3.5.6. | Ceramic-filled vs glass-filled PTFE laminates |
3.5.7. | Concerns of using PTFE-based laminates for high frequency 5G |
3.5.8. | PTFE laminate suppliers: Rogers' Advanced Connectivity Solutions |
3.5.9. | PTFE laminate suppliers: Rogers' ceramic-filled PTFE laminates |
3.5.10. | PTFE laminate suppliers: Taconic |
3.5.11. | PTFE laminate suppliers: SYTECH |
3.6. | Sustainability in low-loss materials: PTFE |
3.6.1. | Introduction to PFAS |
3.6.2. | Concerns with PFAS |
3.6.3. | Regulatory outlook for PFAS: EU |
3.6.4. | Regulatory outlook for PFAS: USA |
3.6.5. | Dutch court ruling on environmental damage caused by PFAS materials |
3.6.6. | Regulations on PFAS as relevant to low-loss materials |
3.7. | Other organic materials |
3.7.1. | Poly(p-phenylene oxide) (PPO): Sabic |
3.7.2. | Poly(p-phenylene ether) (PPE): Panasonic's MEGTRON |
3.7.3. | Modified poly(p-phenylene ether) (mPPE): Asahi Kasei's XYRON |
3.7.4. | Polyphenylene sulfide (PPS): Solvay's materials for base station antennas |
3.7.5. | Polyphenylene sulfide (PPS): Toray's transparent, heat-resistant film |
3.7.6. | Polybutylene terephthalate (PBT): Toray |
3.7.7. | Hydrocarbon-based laminates |
3.7.8. | Polymer aerogels as antenna substrates |
3.7.9. | Aerogel suppliers: Blueshift's AeroZero for polyimide aerogel laminates |
3.7.10. | Wood-derived cellulose nanofibril |
3.7.11. | Polycarbonate (PC): Covestro's materials for injection-molded enclosures and covers |
3.8. | Inorganic materials |
3.9. | Ceramics/low-temperature co-fired ceramics (LTCC) |
3.9.1. | 5G application areas for ceramics/LTCC |
3.9.2. | Introduction to ceramic materials |
3.9.3. | The evolution from HTCC to LTCC |
3.9.4. | Benchmark of LTCC materials |
3.9.5. | Dielectric constant: Stability vs frequency for different inorganic substrates (LTCC, glass) |
3.9.6. | Temperature stability of dielectric parameters of HTCC and LTCC alumina |
3.9.7. | LTCC suppliers: Ferro |
3.9.8. | LTCC suppliers: DuPont |
3.9.9. | LTCC and HTCC-based substrates |
3.9.10. | HTCC metal-ceramic packages |
3.9.11. | LTCC substrate for RF transitions |
3.9.12. | Production challenges of multilayer LTCC package |
3.9.13. | LTCC suppliers: Kyocera's LTCC-based packages |
3.9.14. | LTCC suppliers: Kyocera's LTCC-based packages |
3.9.15. | LTCC suppliers: Kyocera's LTCC-based products and development projects |
3.9.16. | Need for filter technologies beyond SAW/BAW |
3.9.17. | Filter technologies compatible with mmWave 5G |
3.9.18. | Benchmark of selected filter technologies for mmWave 5G applications |
3.9.19. | Materials for transmission-line filters |
3.9.20. | Role of LTCC and glass for future RF filter substrates |
3.9.21. | LTCC suppliers: NGK's multi-layer LTCC filters |
3.9.22. | LTCC suppliers: Minicircuits' multilayer LTCC filter |
3.9.23. | LTCC suppliers: Sunway communication's phased array antenna for mmWave 5G phones |
3.9.24. | LTCC suppliers: Tecdia's thin film and ceramic capacitors |
3.10. | Glass |
3.10.1. | Glass substrate |
3.10.2. | Benchmark of various glass substrates |
3.10.3. | Glass suppliers: JSK's HF-F for low transmission loss laminates |
3.10.4. | Glass suppliers: SCHOTT's FLEXINITY connect |
3.10.5. | Glass suppliers: AGC/ALCAN System's transparent antennas for windows |
3.10.6. | Glass as a filter substrate |
3.10.7. | Glass integrated passive devices (IPD) filter for 5G by Advanced Semiconductor Engineering |
3.10.8. | Summary of low-loss materials for PCBs and RF components |
3.10.9. | Benchmarking of commercial low-loss materials for 5G PCBs/components |
3.10.10. | Status and outlook of commercial low-loss materials for 5G PCBs/components |
3.10.11. | Property overview of low-loss materials |
3.10.12. | Options for mmWave filter substrates |
4. | LOW-LOSS MATERIALS AT THE PACKAGE-LEVEL |
4.1. | Overview of electronic and semiconductor packaging |
4.1.1. | Overview of general electronic packaging |
4.1.2. | Overview of advanced semiconductor packaging |
4.1.3. | From 1D to 3D semiconductor packaging |
4.1.4. | Overview of semiconductor packaging technologies |
4.1.5. | Packaging trends for 5G and 6G connectivity |
4.2. | System in package (SiP) |
4.2.1. | Heterogeneous integration solutions |
4.2.2. | Overview of System on Chip (SOC) |
4.2.3. | Overview of Multi-Chip Module (MCM) |
4.2.4. | System in Package (SiP) |
4.2.5. | Analysis of System in Package (SiP) |
4.2.6. | Trend of increasing SiP content in electronics |
4.3. | Towards AiP (antenna in package) |
4.3.1. | High frequency integration and packaging trend |
4.3.2. | Qualcomm: Antenna in package design (antenna on a substrate with flip chipped ICs) |
4.3.3. | Evolution of Qualcomm mmWave AiP |
4.3.4. | High frequency integration and packaging: Requirements and challenges |
4.3.5. | Three methods for mmWave antenna integration |
4.3.6. | Benchmarking of antenna packaging technologies |
4.3.7. | AiP development trend |
4.3.8. | Two types of AiP structures |
4.3.9. | Two types of IC-embedded technology |
4.3.10. | Two types of IC-embedded technology |
4.3.11. | Key market players for IC-embedded technology by technology type |
4.3.12. | Low loss materials: Key for 5G mmWave AiP |
4.3.13. | Choices of low-loss materials for 5G mmWave AiP |
4.3.14. | Benchmark of low loss materials for AiP |
4.3.15. | Organic materials: the mainstream choice for substrates in AiP |
4.3.16. | LTCC AiP for 5G: TDK |
4.3.17. | Glass substrate AiP for 5G: Georgia Tech |
4.3.18. | Summary of AiP for 5G |
4.4. | Epoxy molded compounds (EMC) and mold under fill (MUF) |
4.4.1. | What are EMC and MUFs? |
4.4.2. | Epoxy Molding Compound (EMC) |
4.4.3. | Key parameters for EMC materials |
4.4.4. | Importance of dielectric constant for EMC used in 5G applications |
4.4.5. | Experimental and commercial EMC products with low dielectric constant |
4.4.6. | Epoxy resin: Parameters of different resins and hardener systems |
4.4.7. | Fillers for EMC |
4.4.8. | EMC for warpage management |
4.4.9. | Supply chain for EMC materials |
4.4.10. | EMC innovation trends for 5G applications |
4.4.11. | High warpage control EMC for FO-WLP |
4.4.12. | Possible solutions for warpage and die shift |
4.4.13. | EMC suppliers: Sumitomo Bakelite |
4.4.14. | EMC suppliers: Sumitomo Bakelite |
4.4.15. | EMC suppliers: Kyocera's EMCs for semiconductors |
4.4.16. | EMC suppliers: Samsung SDI |
4.4.17. | EMC suppliers: Showa Denko |
4.4.18. | EMC suppliers: Showa Denko's sulfur-free EMC |
4.4.19. | EMC suppliers: KCC Corporation |
4.4.20. | Molded underfill (MUF) |
4.4.21. | MUF critical for flip clip molding technology |
4.4.22. | Liquid molding compound (LMC) for compression molding |
4.5. | Ink-based EMI shielding |
4.5.1. | What is electromagnetic interference (EMI) shielding? |
4.5.2. | Package shielding involves compartmental and conformal shielding |
4.5.3. | What materials are used for EMI shielding? |
4.5.4. | Impact of changes in semiconductor package design |
4.5.5. | Key trends for EMI shielding implementation |
4.5.6. | Comparison of sputtering and spraying |
4.5.7. | Process flow for competing printing methods |
4.5.8. | Supplier details confirm that sputtering is the dominant approach |
4.5.9. | Value chain for conformal package-level shielding |
4.5.10. | Sputtering for package-level EMI shielding |
4.5.11. | Conclusions: Spraying/printing for package-level EMI shielding |
4.5.12. | Other deposition methods for package-level EMI shielding |
4.5.13. | Early commercial example of package-level shielding |
4.5.14. | Conformal package-level EMI shielding accompanied by compartmentalization |
4.5.15. | Smartphone deployment example: Conformal shielding in Apple iPhone 12 |
4.5.16. | Suppliers targeting ink-based conformal EMI shielding |
4.5.17. | Ink-based EMI shielding suppliers: Henkel |
4.5.18. | Ink-based EMI shielding suppliers: Duksan |
4.5.19. | Ink-based EMI shielding suppliers: Ntrium |
4.5.20. | Ink-based EMI shielding suppliers: Clariant |
4.5.21. | Ink-based EMI shielding suppliers: Fujikura Kasei |
4.5.22. | Spray machines used in conformal EMI shielding |
4.5.23. | Particle size and morphology influence EMI shielding |
4.5.24. | EMI shielding with particle-free inks |
4.5.25. | Heraeus' inkjet printed particle-free Ag inks |
4.5.26. | Key trend for EMI shielding: Compartmentalization of complex packages |
4.5.27. | The challenge of magnetic shielding at low frequencies (I) |
4.5.28. | The challenge of magnetic shielding at low frequencies (II) |
5. | LOW-LOSS MATERIALS AT THE WAFER-LEVEL |
5.1. | Redistribution layer (RDL) |
5.2. | Redistribution layer (RDL) vs silicon |
5.3. | Importance of low-loss RDL materials for different packaging technologies |
5.4. | Low-loss RDL materials for mmWave: TSMC's InFO AiP |
5.5. | Polymer dielectric materials for RDL |
5.6. | Key parameters for organic RDL materials for next generation 2.5D fan-out packaging |
5.7. | Benchmark of organic dielectrics for RDL |
5.8. | RDL-dielectric suppliers: Toray's polyimide materials |
5.9. | RDL-dielectric suppliers: DuPont's Arylalkyl polymers |
5.10. | RDL-dielectric suppliers: DuPont's InterVia |
5.11. | RDL-dielectric suppliers: HD Microsystems |
5.12. | RDL-dielectric suppliers: Taiyo Ink's epoxy-based high-density RDL |
5.13. | RDL-dielectric suppliers: Ajinomoto's nanofiller ABF |
5.14. | RDL-dielectric supplier: Showa Denko |
5.15. | Market for low-loss RDLs - Advanced semiconductor packages for 5G smartphones |
5.16. | Overview: Redistribution layers in advanced semiconductor packages for 5G smartphones |
6. | LOW-LOSS MATERIALS FOR 6G |
6.1. | Overview |
6.1.1. | Evolution of mobile communications |
6.1.2. | 5G/6G development and standardization roadmap |
6.1.3. | IDTechEx outlook for 6G |
6.1.4. | 6G spectrum - Which bands are considered? |
6.1.5. | Spectrum outlook from 2G to 6G |
6.1.6. | Overview of potential 6G services |
6.1.7. | 6G - An overview of key applications |
6.1.8. | Overview of land-mobile service applications in the frequency range 275-450 GHz |
6.1.9. | Summary: Global trends and new opportunities in 6G |
6.1.10. | Technical innovation comparison between 5G and 6G |
6.1.11. | IDTechEx outlook of low-loss materials for 6G |
6.1.12. | Research approaches for 6G low-loss materials by material category |
6.1.13. | RDL materials for 6G |
6.1.14. | Polyimide films for 6G |
6.1.15. | Thermoplastics for 6G: Georgia Tech |
6.1.16. | PTFE for 6G: Yonsei University, GIST |
6.1.17. | PPS for 6G: Sichuan University |
6.1.18. | Thermosets for 6G: ITEQ Corporation, INAOE |
6.1.19. | PPE for 6G: Taiyo Ink, Georgia Institute of Technology |
6.1.20. | Silicate materials for 6G: University of Oulu, University of Szeged |
6.1.21. | Silicate materials for 6G: Aalborg University, Penn State |
6.1.22. | Silicate materials for 6G: Tokyo Institute of Technology, AGC |
6.1.23. | Glass for 6G: Georgia Tech |
6.1.24. | Glass interposers for 6G |
6.1.25. | LTCC for 6G: Fraunhofer IKTS |
6.1.26. | Ceramics for 6G: overview |
6.1.27. | Alumina fillers for 6G: National Institute of Advanced Industrial Science and Technology |
6.1.28. | Sustainable materials for 6G: University of Oulu |
6.1.29. | Metal interposers for 6G: Cubic-Nuvotronics |
6.1.30. | Roadmap for development of low-loss materials for 6G |
6.1.31. | Roadmap for development of low-loss materials for 6G |
6.1.32. | Standards for low-loss materials for 6G |
6.2. | Radio-frequency metamaterials for 6G |
6.2.1. | What is a metamaterial? |
6.2.2. | Segmenting the metamaterial landscape |
6.2.3. | Metamaterials for 6G: Reconfigurable intelligent surfaces (RIS) |
6.2.4. | Key drivers for reconfigurable intelligent surfaces in telecommunications |
6.2.5. | The current status of reconfigurable intelligent surfaces (RIS) |
6.2.6. | Key takeaways for RIS |
6.2.7. | Materials selection for RF metamaterials: Introduction |
6.2.8. | Operational frequency ranges by application |
6.2.9. | Comparing relevant substrate materials at low frequencies |
6.2.10. | Comparing relevant substrate materials at high frequencies |
6.2.11. | Identifying suitable materials for active RF metamaterials near THz |
6.2.12. | PP and PTFE show better performance than PET |
6.2.13. | RIS for 5G/6G: Suitable RF metamaterials |
6.2.14. | Metamaterials in RIS for 5G/6G: SWOT |
7. | FORECASTS |
7.1. | Forecast methodology and scope |
7.2. | Low-loss material forecasts for 5G |
7.2.1. | Forecast of low-loss materials for 5G: Area and revenue |
7.2.2. | Forecast of low-loss materials for 5G segmented by material type: Revenue and area |
7.2.3. | Forecast of low-loss materials for 5G segmented by frequency |
7.2.4. | Market discussion: Low-loss materials for 5G |
7.3. | Low-loss material forecasts for 5G infrastructure |
7.3.1. | Forecast of low-loss materials for 5G base stations segmented by frequency |
7.3.2. | Forecast of low-loss materials for 5G base stations segmented by material |
7.3.3. | Market discussion: Low-loss materials for 5G base stations |
7.3.4. | Forecast of low-loss materials for 5G base stations segmented by components |
7.4. | Low-loss material forecasts for 5G smartphones |
7.4.1. | Forecast of low-loss materials for 5G smartphone antennas segmented by frequency |
7.4.2. | Forecast of low-loss materials for 5G smartphone antennas segmented by material |
7.4.3. | Market discussion: Low-loss materials for 5G smartphone antennas |
7.5. | Low-loss material forecasts for 5G customer premises equipment (CPEs) |
7.5.1. | Forecast of low-loss materials for 5G CPEs segmented by frequency: Area and revenue |
7.5.2. | Forecast of low-loss materials for 5G CPEs segmented by material: Area and revenue |
7.5.3. | Market discussion: Low-loss materials for 5G CPEs |
8. | CONCLUSION |
8.1. | Conclusions |
9. | COMPANY PROFILES |
10. | APPENDIX |
10.1. | Forecast of low-loss materials for 5G base stations segmented by material and component |
10.2. | Forecast for low-loss materials for 5G - Segmented by frequency and application |
10.3. | Forecast of low-loss materials for 5G smartphones segmented by material |
10.4. | Forecast of low-loss materials for 5G CPEs segmented by material |
10.5. | Forecast of low-loss materials for 5G segmented by material |