1. | EXECUTIVE SUMMARY |
1.1. | Printed/flexible electronics: Analyst viewpoint (I) |
1.2. | Printed/flexible electronics: Analyst viewpoint (II) |
1.3. | What is printed/flexible electronics? |
1.4. | Motivation for printed/flexible electronics |
1.5. | Printed/flexible electronics and the hype curve: progressing towards product market fit |
1.6. | Segmenting the printed/flexible electronics industry landscape |
1.7. | Printed/flexible electronics in automotive applications: Overview |
1.8. | Overview: Printed/flexible electronics in consumer goods |
1.9. | Overview: Printed/flexible electronics in the energy sector |
1.10. | Overview: Printed/flexible electronics in healthcare / wellness |
1.11. | Overview: Printed/flexible electronics in infrastructure / buildings / industrial |
1.12. | Printed/flexible electronics area forecast by application sector (2023, 2028, 2033) |
1.13. | Printed/flexible electronics area forecast by application sector: 2021 - 2033 |
1.14. | Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) |
1.15. | Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) |
1.16. | Manufacturing methods for printed/flexible electronics: Overview |
1.17. | Printed electronics is additive, but can be analogue or digital |
1.18. | Comparison of printing methods: Resolution vs throughput |
1.19. | Overall forecast: Analogue printing methods |
1.20. | Overall forecast: Digital printing methods |
1.21. | Manufacturing methods for printed/flexible electronics: Key conclusions |
1.22. | Materials for printed/flexible electronics: Overview |
1.23. | Overall forecast: Conductive ink volume (segmented by ink type) |
1.24. | Overall forecast: Conductive ink revenue (segmented by ink type) |
1.25. | Materials for printed/flexible electronics: Key conclusions |
1.26. | Components for printed/flexible electronics: Overview |
1.27. | Components for printed/flexible electronics: Key conclusions |
2. | INTRODUCTION |
2.1. | What is printed/flexible electronics? |
2.2. | Motivation for printed/flexible electronics (I) |
2.3. | Printed/flexible electronics and the hype curve: progressing towards product market fit |
2.4. | Engagement with printed/flexible electronics from the wider electronics industry |
2.5. | Macro-trends driving printed/flexible electronics: Increased use of AI / machine learning for continuous monitoring |
2.6. | Macro-trends driving printed/flexible electronics: Desire for differentiation and customization |
2.7. | Macro-trends driving printed/flexible electronics: Importance of sustainability |
2.8. | Macro-trends driving printed/flexible electronics: Transition towards ambient computing |
3. | MARKET FORECASTS |
3.1. | Overview |
3.1.1. | Market forecasting methodology: Applications |
3.1.2. | Market forecasting methodology: Materials, components and manufacturing methods |
3.1.3. | Printed/flexible electronics area forecast by application sector (2023, 2028, 2033) |
3.1.4. | Printed/flexible electronics area forecast by application sector: 2021 - 2033 |
3.1.5. | Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) |
3.1.6. | Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) |
3.2. | Market forecasts: Application sectors |
3.2.1. | Automotive applications of printed/flexible electronics by area (thousand m2) |
3.2.2. | Automotive applications of printed/flexible electronics by revenue (USD millions) |
3.2.3. | Consumer goods applications of printed/flexible electronics by area (thousand m2) |
3.2.4. | Consumer goods applications of printed/flexible electronics by revenue (USD millions) |
3.2.5. | Energy applications of printed/flexible electronics by area (thousand m2) |
3.2.6. | Energy applications of printed/flexible electronics by revenue (USD millions) |
3.2.7. | Healthcare/wellness/apparel applications of printed/flexible electronics by area (thousand m2) |
3.2.8. | Healthcare/wellness applications of printed/flexible electronics by revenue (USD millions) |
3.2.9. | Infrastructure/buildings/industrial applications of printed/flexible electronics by area (thousand m2) |
3.2.10. | Infrastructure/buildings/industrial applications of printed/flexible electronics by revenue (USD millions) |
3.3. | Market forecasts: Manufacturing methods |
3.3.1. | Overall forecast: Analogue printing methods |
3.3.2. | Overall forecast: Analogue printing methods (proportion) |
3.3.3. | Overall forecast: Digital printing methods |
3.3.4. | Overall forecast: Digital printing methods (proportion) |
3.4. | Market forecasts: Conductive inks |
3.4.1. | Overall forecast: Conductive ink volume (segmented by ink type) |
3.4.2. | Overall forecast: Conductive ink revenue (segmented by ink type) |
4. | OVERVIEW OF APPLICATION SECTORS |
4.1. | Introduction to application sectors |
4.1.1. | Application sectors for printed/flexible electronics |
4.2. | Application sectors: Automotive |
4.2.1. | Automotive applications for printed/flexible electronics: Introduction |
4.2.2. | Industry transitions require new differentiators |
4.2.3. | Printed/flexible electronics enables cost differentiation and/or cost reduction |
4.2.4. | Printed/flexible electronics opportunities from car interior trends |
4.2.5. | Printed electronics for HMI gains commercial traction |
4.2.6. | Increasing interest in printed heaters for surface heating in vehicles |
4.2.7. | Automotive transparent antennas enable windows to be functionalized |
4.2.8. | Printed/flexible electronics for automotive applications: SWOT analysis |
4.2.9. | Printed/flexible electronics in vehicle interiors: Readiness level assessment |
4.2.10. | Printed/flexible electronics in vehicle exteriors: Readiness level assessment |
4.2.11. | Automotive applications for printed/flexible electronics: Conclusions |
4.3. | Application sectors: Consumer goods |
4.3.1. | Consumer goods applications for printed/flexible electronics: Introduction |
4.3.2. | Embedding electronics in natural materials |
4.3.3. | Electronics on 3D surfaces with extruded conductive paste and inkjet printing |
4.3.4. | Extruded conductive paste for antennas |
4.3.5. | Printed RFID antennas struggle for traction: Is copper ink a solution? |
4.3.6. | Smart packaging with flexible hybrid electronics |
4.3.7. | OLEDs for smart packaging |
4.3.8. | Printed/flexible electronics for consumer goods: SWOT analysis |
4.3.9. | Consumer goods applications for printed/flexible electronics: Conclusions |
4.4. | Application sectors: Energy |
4.4.1. | Energy applications for printed/flexible electronics: Introduction |
4.4.2. | Conductive pastes for photovoltaics |
4.4.3. | Flake-based conductive inks face headwind from alternative solar cell connection technology |
4.4.4. | Organic photovoltaics gains traction |
4.4.5. | Renaissance of organic photovoltaics (OPV) continues |
4.4.6. | Perovskite PV shows rapid efficiency gains to be comparable with silicon |
4.4.7. | Companies aiming to commercialize thin film flexible PV |
4.4.8. | Thin film perovskite PV roadmap |
4.4.9. | Printed/flexible electronics for energy: SWOT analysis |
4.4.10. | Printed/flexible electronics for energy: Conclusions |
4.5. | Application sectors: Healthcare / wellness |
4.5.1. | Healthcare/wellness applications for printed/flexible electronics: Introduction |
4.5.2. | Electrochemical biosensors present a simple sensing mechanism that utilizes printed electronics |
4.5.3. | Interest in skin patches for continuous biometric monitoring continues |
4.5.4. | Material suppliers collaboration has enabled large scale trials of wearable skin patches |
4.5.5. | In-hospital applications remain promising but challenging |
4.5.6. | E-textiles and wearable sensing aims to overcome washability issues |
4.5.7. | Progress in using liquid metal alloys as stretchable inks for wearable electronics |
4.5.8. | Printed pH sensors for biological fluids |
4.5.9. | Key requirements of wearable electrodes |
4.5.10. | Increased demand for wearable/medical manufacturing leads to expansion plans |
4.5.11. | Smart-packaging to improve pharmaceutical compliance |
4.5.12. | Printed/flexible electronics for healthcare / wellness applications: SWOT analysis |
4.5.13. | Printed/flexible electronics for healthcare / wellness applications: SWOT analysis (II) |
4.5.14. | Printed/flexible electronics for healthcare / wellness applications: Readiness level |
4.5.15. | Printed/flexible electronics for healthcare/wellness applications: Conclusions |
4.6. | Application sectors: Infrastructure / buildings / industrial |
4.6.1. | Infrastructure / buildings / industrial applications for printed/flexible electronics: Introduction |
4.6.2. | Industrial asset tracking/monitoring with hybrid electronics |
4.6.3. | Capacitive sensors integrated into floors and wall panels |
4.6.4. | Printed electronics enables cost-effective building and environment sensing |
4.6.5. | Building integrated transparent antennas and reconfigurable intelligent surfaces |
4.6.6. | Material choice for passive RIS |
4.6.7. | Integrated electronics enable industrial monitoring |
4.6.8. | Integrated electronics promises customizable interiors |
4.6.9. | Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (I) |
4.6.10. | Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (II) |
4.6.11. | Printed/flexible electronics for infrastructure / buildings / industrial applications: Conclusions |
5. | MANUFACTURING METHODS FOR PRINTED/FLEXIBLE ELECTRONICS: OVERVIEW |
5.1. | Introduction |
5.1.1. | Manufacturing methods for printed/flexible electronics: Overview |
5.1.2. | Printed electronics is additive, but can be analogue or digital |
5.1.3. | Comparison of printing methods: Resolution vs throughput |
5.1.4. | Ensuring reliability of printed/flexible electronics is crucial |
5.1.5. | Digitization in manufacturing facilitates 'printed-electronics-as-a-service' |
5.2. | Manufacturing methods: 3D electronics |
5.2.1. | 3D electronics: Introduction |
5.2.2. | Additive electronics and the transition to three dimensions |
5.2.3. | 3D/additive electronics spans multiple length scales |
5.2.4. | Fully 3D printed electronics process steps |
5.2.5. | Interest in fully additive electronics continues with new entrant |
5.2.6. | Advantages of fully additively manufactured 3D electronics |
5.2.7. | 3D electronics: SWOT analysis |
5.2.8. | Readiness level of additive manufacturing technologies |
5.2.9. | 3D electronics: Conclusions |
5.3. | Manufacturing methods: Analogue manufacturing |
5.3.1. | Analogue printing: Introduction |
5.3.2. | Conventional screen printing companies continue to embrace printed/flexible electronics |
5.3.3. | Improvements in screen printing resolution |
5.3.4. | High resolution screen-printing for wrap around electrodes |
5.3.5. | Cliché-based printing methods |
5.3.6. | Highs resolutions possible with reverse offset printing |
5.3.7. | Analogue printing: SWOT analysis |
5.3.8. | Benchmarking analogue printing methods |
5.3.9. | Technological and commercial readiness level of analogue printing methods |
5.3.10. | Summary: Analogue printing methods |
5.4. | Manufacturing methods: Digital printing |
5.4.1. | Digital printing: Introduction |
5.4.2. | Digital printing spans multiple length scales |
5.4.3. | Benchmarking digital printing methods |
5.4.4. | Comparing deposition methods |
5.4.5. | Operating mechanism of laser induced forward transfer (LIFT) |
5.4.6. | Digital manufacturing continues to gain traction |
5.4.7. | Innovations in high resolution printing |
5.4.8. | Increased emphasis on prototyping with additive electronics |
5.4.9. | Digital printing: SWOT analysis |
5.4.10. | Digital printing: Readiness levels |
5.4.11. | Digital printing: Conclusions |
5.5. | Manufacturing methods: Flexible hybrid electronics |
5.5.1. | Flexible hybrid electronics: Introduction |
5.5.2. | FHE takes a 'best of both' approach |
5.5.3. | Flexible hybrid electronics (FHE) |
5.5.4. | Comparing benefits of conventional and printed/flexible electronics |
5.5.5. | FHE value chain: Many materials and technologies |
5.5.6. | Wearable skin patches - another stretchable ink application |
5.5.7. | Development from conventional boxed to flexible hybrid electronics will be challenging |
5.5.8. | Condition monitoring multimodal sensor array |
5.5.9. | Multi-sensor wireless asset tracking system demonstrates FHE potential |
5.5.10. | A new contract manufacturer for flexible hybrid electronics (FHE) emerges |
5.5.11. | Flexible hybrid electronics (FHE): SWOT analysis |
5.5.12. | Flexible hybrid electronics (FHE): Conclusions |
5.6. | Manufacturing methods: In-mold electronics |
5.6.1. | In-mold electronics (IME): Introduction |
5.6.2. | IME manufacturing process flow |
5.6.3. | Comparing smart surface manufacturing methods |
5.6.4. | Segmenting IME manufacturing techniques |
5.6.5. | Commercial advantages of IME |
5.6.6. | IME value chain - a development of in-mold decorating (IMD) |
5.6.7. | IME value chain overview |
5.6.8. | In-mold electronics without embedded SMD components rapidly gaining traction |
5.6.9. | Overview of specialist materials for IME |
5.6.10. | Materials for IME: A portfolio approach |
5.6.11. | Silver flake-based ink dominates IME |
5.6.12. | Overview of IME and sustainability |
5.6.13. | In-mold electronics: SWOT analysis: |
5.6.14. | Conclusions for the IME industry (I) |
5.7. | Manufacturing methods: R2R manufacturing |
5.7.1. | R2R manufacturing: Introduction |
5.7.2. | Can R2R manufacturing be used for high mix low volume (HMLV)? |
5.7.3. | What is the main commercial challenge for roll-to-roll manufacturing? |
5.7.4. | Examples of R2R pilot/production lines for electronics |
5.7.5. | Commercial printed pressure sensors production via R2R electronics |
5.7.6. | Emergence of a contract manufacturer for flexible hybrid electronics (FHE) |
5.7.7. | Applying 'Industry 4.0' to printed electronics with in-line monitoring |
5.7.8. | Applications of R2R electronics manufacturing |
5.7.9. | R2R manufacturing: SWOT analysis |
5.7.10. | R2R manufacturing: Readiness level |
5.7.11. | R2R manufacturing: Conclusions |
6. | MATERIALS FOR PRINTED/FLEXIBLE ELECTRONICS: OVERVIEW |
6.1. | Introduction |
6.1.1. | Materials for printed/flexible electronics: Overview |
6.1.2. | Materials supplier commercialization strategies (I) |
6.1.3. | Materials supplier commercialization strategies (II) |
6.2. | Materials: Component attachment materials |
6.2.1. | Component attachment material: Introduction |
6.2.2. | Differentiating factors amongst component attachment materials |
6.2.3. | Low temperature solder enables thermally fragile substrates |
6.2.4. | Comparing electrical component attachment materials |
6.2.5. | Durable and efficient component attachment is important for FHE circuit development |
6.2.6. | Field-aligned anisotropic conductive adhesive reaches commercialization |
6.2.7. | Photonic soldering gains traction |
6.2.8. | Component attachment materials (for printed/flexible electronics): SWOT analysis |
6.2.9. | Component attachment materials: Readiness level |
6.2.10. | Component attachment materials for printed/flexible electronics: Conclusions |
6.3. | Materials: Conductive inks |
6.3.1. | Conductive inks: Introduction |
6.3.2. | Conductivity requirements by application |
6.3.3. | Challenges of comparing conductive inks |
6.3.4. | Segmentation of conductive ink technologies |
6.3.5. | Conductive ink companies segmented by conductive material |
6.3.6. | Market evolution and new opportunities |
6.3.7. | What are the key growth markets for conductive inks? |
6.3.8. | Balancing differentiation and ease of adoption |
6.3.9. | Interest in novel conductive inks continues |
6.3.10. | Copper inks gaining traction but not yet widely deployed |
6.3.11. | Companies continue to develop and market stretchable/thermoformable materials |
6.3.12. | Conductive inks: SWOT analysis |
6.3.13. | Conductive inks: Readiness level assessment |
6.3.14. | Conductive inks: Conclusions |
6.4. | Materials: Printable semiconductors |
6.4.1. | Printable semiconducting materials: Introduction |
6.4.2. | Organic semiconductors: Advantages and disadvantages |
6.4.3. | Non-fullerene acceptors support OPV renaissance for non-standard applications |
6.4.4. | Substantial opportunities for OPD and QD materials in hybrid image sensing |
6.4.5. | Interest in OTFTs continues despite struggles |
6.4.6. | Printable semiconductors: SWOT analysis |
6.4.7. | Readiness level of printed semiconductors (organic and perovskite applications) |
6.4.8. | Printable semiconductors: Conclusions |
6.5. | Materials: Printable sensing materials |
6.5.1. | Printable sensing materials: Introduction |
6.5.2. | Drivers for printed/flexible sensors |
6.5.3. | Overview of specific printed/flexible sensor types |
6.5.4. | Polymeric piezoelectric materials receive increasing interest |
6.5.5. | Sensing for industrial IoT |
6.5.6. | Sensing for wearables/AR |
6.5.7. | Companies looking to incorporate printed/ flexible sensors often require a complete solution |
6.5.8. | Printable sensor materials: SWOT analysis |
6.5.9. | Printed sensor materials: Readiness level assessment |
6.5.10. | Printed sensor materials: Conclusions |
6.6. | Materials and components: Substrates |
6.6.1. | Substrates for printed/flexible electronics: Introduction |
6.6.2. | Cost and maximum temperature are correlated |
6.6.3. | Properties of typical flexible substrates |
6.6.4. | Comparing stretchable substrates |
6.6.5. | Thermoset stretchable substrate used in multiple development projects |
6.6.6. | Paper substrates: Advantages and disadvantages |
6.6.7. | Substrates: Conclusions |
7. | OVERVIEW OF COMPONENTS FOR PRINTED/FLEXIBLE ELECTRONICS |
7.1. | Introduction |
7.1.1. | Components for printed/flexible electronics: Overview |
7.1.2. | Component suppliers collaborate on smart packaging and shelf level marketing |
7.1.3. | Using a thin film component as a substrate: A cost-reduction strategy |
7.2. | Components: Electrophoretic / electrochromic displays |
7.2.1. | Electrophoretic / electrochromic displays: Introduction |
7.2.2. | Colored E-ink for vehicle exteriors |
7.2.3. | Electrochromic display architecture |
7.2.4. | Electrochromic display in packaging |
7.2.5. | Electrophoretic / electrochromic displays: SWOT analysis |
7.2.6. | Electrophoretic / electrochromic displays: Readiness level assessment |
7.2.7. | Electrophoretic / electrochromic displays: Conclusions |
7.3. | Components: Flexible batteries |
7.3.1. | Flexible batteries: Introduction |
7.3.2. | 'Thin', 'flexible' and 'printed' are separate properties |
7.3.3. | Major battery company targets printed/flexible batteries for smart packaging |
7.3.4. | Printed flexible batteries in development for smart packaging |
7.3.5. | Technology benchmarking for printed/flexible batteries |
7.3.6. | Flexible batteries: SWOT analysis |
7.3.7. | Application roadmap for printed/flexible batteries |
7.3.8. | Flexible batteries: Conclusions |
7.4. | Components: Flexible ICs |
7.4.1. | Flexible ICs: Introduction |
7.4.2. | Fully printed ICs have struggled to compete with silicon |
7.4.3. | Current approaches to printed logic |
7.4.4. | Embedding thinned silicon ICs in polymer |
7.4.5. | Embedding both thinned ICs and redistribution layer in flexible substrate |
7.4.6. | Investment into metal oxide ICs continues |
7.4.7. | Flexible ICs: SWOT analysis |
7.4.8. | Roadmap for flexible ICs |
7.4.9. | Flexible ICs: Conclusions |
7.5. | Components: Flexible PV for energy harvesting |
7.5.1. | Flexible PV for energy harvesting: Introduction |
7.5.2. | Epishine is leading the way in solar powered IoT |
7.5.3. | Exeger's partnerships show promising future of DSSCs |
7.5.4. | Perovskite PV could be cost-effective alternative for wireless energy harvesting |
7.5.5. | Saule Technologies: Perovskite PV developer for indoor electronics |
7.5.6. | Flexible PV for energy harvesting: Readiness level assessment |
7.5.7. | Flexible PV for energy harvesting: SWOT analysis |
7.5.8. | Flexible PV for energy harvesting: |
8. | COMPANY PROFILES |
8.1. | ACI Materials |
8.2. | Agfa |
8.3. | BeFC |
8.4. | C3 Nano |
8.5. | Chasm |
8.6. | ChemCubed |
8.7. | Coatema |
8.8. | Copprint |
8.9. | CPI |
8.10. | DoMicro |
8.11. | DuPont |
8.12. | Elantas |
8.13. | Electroninks |
8.14. | GE Healthcare |
8.15. | Henkel |
8.16. | Heraeus |
8.17. | Inkron |
8.18. | InnovationLab |
8.19. | Inuru |
8.20. | IOTech |
8.21. | ISORG |
8.22. | Laiier |
8.23. | Liquid Wire |
8.24. | Nano Dimension |
8.25. | Optomec |
8.26. | PolyIC |
8.27. | PragmatIC |
8.28. | PrintCB |
8.29. | PVNanoCell |
8.30. | Saralon |
8.31. | Screentec |
8.32. | Sun Chemical |
8.33. | Sunew |
8.34. | Symbiose |
8.35. | Tactotek |
8.36. | TRAQC |
8.37. | VTT |
8.38. | Wiliot |
8.39. | Ynvisible |
8.40. | Ynvisible/Evonik/EpishineContact IDTechEx |