1. | EXECUTIVE SUMMARY |
1.1. | Introduction to in-mold electronics (IME) |
1.2. | In-mold electronics applications (and prototypes) |
1.3. | IME manufacturing process flow |
1.4. | Comparing smart surface manufacturing methods |
1.5. | Commercial advantages of IME |
1.6. | IME facilitates versioning and localization |
1.7. | IME value chain - a development of in-mold decorating (IMD) |
1.8. | Reviewing the previous in-mold electronics report (2022-2032) |
1.9. | SWOT Analysis: IME-with-SMD |
1.10. | Tactotek announces multiple licensees and collaborations |
1.11. | Overview of IME manufacturing requirements |
1.12. | Overview of competing manufacturing methods |
1.13. | Distinguishing manufacturing methods for 3D electronics |
1.14. | Overview of specialist materials for IME |
1.15. | Overview of IME applications |
1.16. | Overview of IME and sustainability |
1.17. | Conclusions for the IME industry (I) |
1.18. | Conclusions for the IME industry (II) |
1.19. | 10-year forecast for IME-with-SMD component area by application (in m2) |
1.20. | 10-year forecast for IME-with-SMD revenue by application (in USD) |
1.21. | Forecast adoption proportion of manufacturing methodologies for automotive HMI surfaces |
2. | INTRODUCTION |
2.1. | Introduction to in-mold electronics (IME) |
2.2. | Transition from 2D to 2.5D to 3D electronics |
2.3. | Motivation for 3D/additive electronics |
2.4. | In-mold electronics applications (and prototypes) |
2.5. | Deciphering integrated/3D electronics terminology (I) |
2.6. | Deciphering integrated/3D electronics terminology (II) |
2.7. | Comparing smart surface manufacturing methods |
2.8. | Current status of main IME technology developer (TactoTek) |
2.9. | IME value chain overview |
2.10. | In-mold electronics with and without SMD components |
2.11. | The long road to IME commercialization |
2.12. | TactoTek's funding continues to increase |
2.13. | The functionality integration paradox |
2.14. | In-mold electronics lags functional film bonding in automotive adoption |
2.15. | When is functionality integration worthwhile? |
2.16. | Greater functionality integration should enhance value proposition (yields permitting) |
2.17. | Regional differences in IME development |
2.18. | IME players divided by location and value chain stage |
2.19. | Porters' analysis for in-mold electronics |
3. | MARKET FORECASTS |
3.1. | Forecast methodology |
3.2. | IME forecast adjustments relative to previous report |
3.3. | 10-year forecast for IME-with-SMD component area by application (in m2) |
3.4. | 10-year forecast for IME-with-SMD revenue by application (in USD) |
3.5. | 10-year forecasts for IME-without-SMD by application (area and volume) |
3.6. | 10-year forecasts functional foil bonding by application (area and volume) |
3.7. | Addressable market for IME: Automotive |
3.8. | Forecast adoption proportion of manufacturing methodologies for automotive HMI surfaces |
3.9. | 10-year forecast for HMI manufacturing methodology in automotive (area) |
3.10. | 10-year forecast for HMI manufacturing methodology in automotive (revenue) |
3.11. | Future (2033) IME market breakdown by application |
3.12. | IME value capture estimate at market maturity (2033) |
3.13. | Ten-year market forecasts for IME by value capture element (revenue, USD millions) |
3.14. | Value capture by functional ink type |
3.15. | 10-year market forecasts for functional inks in IME-with-SMD |
4. | MANUFACTURING METHODS |
4.1. | Introduction |
4.1.1. | Distinguishing manufacturing methods for 3D electronics |
4.2. | Manufacturing IME |
4.2.1. | Manufacturing IME components |
4.2.2. | IME manufacturing process flow (I) |
4.2.3. | IME manufacturing process flow (II) |
4.2.4. | IME manufacturing process flow (III) |
4.2.5. | Progression towards 3D electronics with IME |
4.2.6. | Manufacturing methods: Conventional electronics vs. IME |
4.2.7. | Alternative IME component architectures |
4.2.8. | Equipment required for IME production |
4.2.9. | Hybrid approach provides an intermediate route to market |
4.2.10. | Forecast progression in IME complexity |
4.2.11. | Surface mount device (SMD) attachment: Before or after forming |
4.2.12. | Component attachment cross-sections |
4.2.13. | One-film vs two-film approach |
4.2.14. | Multilayer IME circuits require cross-overs |
4.2.15. | IC package requirements for IME |
4.2.16. | IME requires special electronic design software |
4.2.17. | Faurecia concept: traditional vs. IME design |
4.2.18. | Conventional vs. IME comparison (Faurecia) |
4.2.19. | IME: value transfer from PCB board to ink |
4.2.20. | Print-then-plate for in-mold electronics |
4.2.21. | Automating IME manufacturing |
4.2.22. | Overview of IME manufacturing requirements |
4.3. | Similar manufacturing methodologies to IME |
4.3.1. | Multiple manufacturing methods similar to IME |
4.3.2. | Comparative advantage of in-mold electronic likely to increase over time |
4.3.3. | Applying functional foils (transfer printing) (I) |
4.3.4. | Applying functional films (evaporated lines) |
4.3.5. | Adding capacitive touch with films |
4.3.6. | Functional film bonding: an introduction |
4.3.7. | Applying functional films into 3D shaped parts (II) (PolyIC) |
4.4. | Other 3D metallization methods |
4.4.1. | Molded interconnect devices (MIDs) for 3D electronics |
4.4.2. | 3D electronics manufacturing method flowchart |
4.4.3. | Approaches to 3D printed electronics |
4.4.4. | Aerosol deposition of conductive inks onto 3D surfaces |
4.4.5. | Laser direct structuring (LDS) |
4.4.6. | Applications of LDS |
4.4.7. | LDS MID application examples: Automotive HMI |
4.4.8. | Extruding conductive paste for structurally-integrated antennas |
4.4.9. | Two shot molding - an alternative method for high volume MID devices |
4.4.10. | Printing electronics on 3D surfaces for automotive applications |
4.4.11. | Replacing wiring bundles with partially additive electronics |
4.4.12. | Application targets for printing wiring onto 3D surfaces |
4.4.13. | The promise of 3D printed electronics |
4.4.14. | Emerging approach: Multifunctional composites with electronics |
4.4.15. | Molding electronics in 3D shaped composites |
4.4.16. | Emerging approach: Electrical functionalization by additive manufacturing |
4.4.17. | Benchmarking competitive processes to 3D electronics |
4.4.18. | Overview of electronics on 3D surfaces |
5. | FUNCTIONALITY WITHIN IME COMPONENTS |
5.1. | Introduction |
5.1.1. | Integrating functionality within IME components |
5.2. | Capacitive touch sensing |
5.2.1. | Capacitive touch sensors overview |
5.2.2. | Capacitive sensors: Operating principle |
5.2.3. | Hybrid capacitive / piezoresistive sensors |
5.2.4. | Emerging current mode sensor readout: Principles |
5.2.5. | Benefits of current-mode capacitive sensor readout |
5.2.6. | SWOT analysis of capacitive touch sensors |
5.3. | Lighting |
5.3.1. | Motivation for integrating lighting with IME |
5.3.2. | Comparing conventional backlighting vs integrated lighting with IME (I) |
5.3.3. | Comparing conventional backlighting vs integrated lighting with IME (II) |
5.4. | Additional functionalities |
5.4.1. | Integration of haptic feedback |
5.4.2. | Thermoformed polymeric haptic actuator |
5.4.3. | Thermoformed 3D shaped reflective LCD display |
5.4.4. | Thermoformed 3D shaped RGD AMOLED with LTPS |
5.4.5. | Antenna integration with IME |
6. | MATERIALS FOR IME |
6.1. | Introduction |
6.1.1. | IME requires a wide range of specialist materials |
6.1.2. | Materials for IME: A portfolio approach |
6.1.3. | All materials in the stack must be compatible: Conductivity perspective |
6.1.4. | Material composition of IME vs conventional HMI components |
6.1.5. | Stability and durability is crucial |
6.1.6. | IME material suppliers |
6.2. | Conductive inks |
6.2.1. | Silver flake-based ink dominates IME |
6.2.2. | Comparing different conductive inks materials |
6.2.3. | Challenges of comparing conductive inks |
6.2.4. | Conductive ink requirements for in-mold electronics |
6.2.5. | Stretchable vs thermoformable conductive inks |
6.2.6. | In-mold electronics requires thermoformable conductive inks |
6.2.7. | Bridging the conductivity gap between printed electronics and IME inks |
6.2.8. | Gradual improvement over time in thermoformability |
6.2.9. | Thermoformable conductive inks from different resins |
6.2.10. | The role of particle size in thermoformable inks |
6.2.11. | Selecting right fillers and binders to improve stretchability (Elantas) |
6.2.12. | The role of resin in stretchable inks |
6.2.13. | All materials in the stack must be compatible: forming perspective |
6.2.14. | New ink requirements: Surviving heat stress |
6.2.15. | New ink requirements: Stability |
6.2.16. | Particle-free thermoformable inks (I) (E2IP/National Research Council of Canada) |
6.2.17. | Particle-free thermoformable inks (II) (E2IP/National Research Council of Canada) |
6.2.18. | In-mold conductive inks on the market |
6.2.19. | In-mold conductive ink examples |
6.2.20. | Polythiophene-based conductive films for flexible devices (Heraeus) |
6.3. | Dielectric inks |
6.3.1. | Dielectric inks for IME |
6.3.2. | Multilayer IME circuits require cross-overs |
6.3.3. | Cross-over dielectric: Requirements |
6.4. | Electrically conductive adhesives |
6.4.1. | Electrically conductive adhesives: General requirements and challenges for IME |
6.4.2. | Electrically conductive adhesives: Surviving the IME process |
6.4.3. | Specialist formable conductive adhesives required |
6.4.4. | Different types of conductive adhesives |
6.4.5. | Comparing ICAs and ACAs |
6.4.6. | Attaching components to low temperature substrates |
6.5. | Transparent conductive materials |
6.5.1. | Stretchable carbon nanotube transparent conducting films |
6.5.2. | Prototype examples of carbon nanotube in-mold transparent conductive films |
6.5.3. | 3D touch using carbon nanobuds |
6.5.4. | Prototype examples of in-mold and stretchable PEDOT:PSS transparent conductive films |
6.5.5. | In-mold and stretchable metal mesh transparent conductive films |
6.5.6. | Other in-mold transparent conductive film technologies |
6.6. | Substrates and thermoplastics |
6.6.1. | Substrates and thermoplastics for IME |
6.6.2. | Different molding materials and conditions |
6.6.3. | Special PET as alternative to common PC? |
6.6.4. | Can TPU also be a substrate? |
6.6.5. | Covestro: Plastics for IME |
7. | APPLICATIONS, COMMERCIALIZATION, AND PROTOTYPES |
7.1. | Introduction |
7.1.1. | IME interfaces break the cost/value compromise |
7.2. | Automotive |
7.2.1. | Motivation for IME in automotive applications |
7.2.2. | Opportunities for IME in automotive HMI |
7.2.3. | Addressable market in vehicle interiors in 2020 and 2025 |
7.2.4. | Automotive: In-mold decoration product examples |
7.2.5. | Early case study: Ford and T-ink |
7.2.6. | GEELY seat control: Development project not pursued |
7.2.7. | Capacitive touch panel with backlighting |
7.2.8. | Direct heating of headlamp plastic covers |
7.2.9. | Steering wheel with HMI (Canatu) |
7.2.10. | Quotes on the outlook for IME in automotive applications |
7.2.11. | Readiness level of printed/flexible electronics in vehicle interiors |
7.2.12. | Threat to automotive IME: Touch sensitive interior displays |
7.2.13. | Alternative to automotive IME: Integrated stretchable pressure sensors |
7.2.14. | Alternative to automotive IME: Integrated capacitive sensing |
7.3. | White goods |
7.3.1. | Opportunities for IME in white goods |
7.3.2. | Example prototypes of IME for white goods (I) |
7.3.3. | Example prototypes of IME for white goods (II) |
7.4. | Other applications |
7.4.1. | Other IME applications: Medical and industrial HMI |
7.4.2. | Home automation creates opportunities for IME |
7.4.3. | IME for home automation becomes commercial |
7.4.4. | Consumer electronics prototypes to products |
7.4.5. | Commercial products: wearable technology |
7.4.6. | Weight savings make IME compelling for aerospace applications |
8. | IME AND SUSTAINABILITY |
8.1. | IME and sustainability |
8.2. | IME reduces plastic consumption |
8.3. | VTT life cycle assessment of IME parts |
8.4. | IME vs reference component kg CO₂ equivalent (single IME panel): Cradle to gate |
8.5. | IME vs reference component kg CO₂ equivalent (100,000 IME panels): Cradle-to-grave |
8.6. | Summary of results from VTT's life cycle assessment |
9. | FUTURE DEVELOPMENTS FOR IME |
9.1. | IME with incorporated ICs |
9.2. | Laser induced forward transfer (LIFT) could replace screen printing |
9.3. | Thin film digital heaters for in-mold electronics thermoforming |
9.4. | S-shape copper traces facilitate stretchability without loss of conductivity |
10. | COMPANY PROFILES |
10.1. | ACI Materials |
10.2. | Advanced Decorative Systems |
10.3. | Butler Technologies |
10.4. | Canatu |
10.5. | Chasm |
10.6. | Clayens NP |
10.7. | Covestro |
10.8. | Dycotec |
10.9. | E2IP |
10.10. | Elantas |
10.11. | EptaNova |
10.12. | Faurecia |
10.13. | ForceIoT |
10.14. | GenesInk |
10.15. | Henkel |
10.16. | MacDermid Alpha |
10.17. | Nagase ChemteX |
10.18. | Niebling |
10.19. | Plastic Electronic |
10.20. | PolyIC |
10.21. | Sigma Sense |
10.22. | Sun Chemical |
10.23. | Symbiose |
10.24. | TactoTek |
10.25. | TG0 |