1. | EXECUTIVE SUMMARY |
1.1. | Sustainability is of growing importance in the electronics industry |
1.2. | Europe aiming to double global market share of integrated circuits |
1.3. | International supply chain comes with heavy emissions burden |
1.4. | Large share of renewables in developed countries could reduce 'reshoring' cost premium |
1.5. | Digital manufacturing can facilitate sustainable electronics manufacturing |
1.6. | Recycling/reuse initiatives are a strong opportunity |
1.7. | One third of emissions from the electronics industry are produced by integrated circuits |
1.8. | Market status of FR4 alternatives |
1.9. | Sustainability benefits of PCB manufacturing with 'print and plate' |
1.10. | Comparing component attachment types |
1.11. | Market readiness of different solders and ECAs |
1.12. | Etchant produces largest amount of hazardous waste in PCB manufacturing |
1.13. | Ingot sawing costs industry billions in lost silicon and wasted energy |
1.14. | Gallium nitride is more sustainable and lower cost than silicon for ICs |
1.15. | PragmatIC developing thin film alternatives to silicon with 1000x lower embedded energy |
1.16. | Dry (plasma) etching could provide long-term savings and reduce toxic waste in IC manufacturing |
1.17. | Physical vapour deposition may be the best choice for IC copper interconnects |
1.18. | Water conservation increasing among major players |
1.19. | Samsung operating global take-back schemes |
1.20. | Key takeaways (i) |
1.21. | Key takeaways (ii) |
1.22. | Key takeaways (iii) |
2. | INTRODUCTION |
2.1. | The electronics industry today |
2.2. | Sustainability is of growing importance in the electronics industry |
2.3. | EU aims to cut emissions by >55 % by 2030 |
2.4. | 'Fit for 55' expected to drive forward a sustainable electronics industry within the EU |
2.5. | Global electronics industry may follow suit |
2.6. | Large share of renewables could benefit low-cost manufacturing |
2.7. | Ubiquitous electronics require sustainable solutions |
2.8. | Engaging with sustainability promotes new opportunities in the electronics industry |
2.9. | Conventional electronics manufacturing poses obstacles to sustainability challenge |
2.10. | Sustainability regulations around the world impacting the electronic industry |
2.11. | Carbon prices are expected to rise |
2.12. | The SEC is cracking down on greenwashing |
2.13. | Manufacturing strategies to increase speed and reduce embedded energy |
2.14. | Digital manufacturing can facilitate sustainable electronics manufacturing |
2.15. | Recycling/reuse initiatives for electronics gain traction |
2.16. | International supply chain comes with heavy emissions burden |
2.17. | Traditional PCBs: Emissions reductions enabled by on-site prototyping |
2.18. | Report structure (i): PCB value chain |
2.19. | Report structure (ii): Integrated circuits (ICs) value chain |
3. | MARKET FORECASTS |
3.1. | Forecasting methodology |
3.2. | PCB substrate production |
3.3. | PCB substrate revenue |
3.4. | Patterning and metallization: Rigid PCBs |
3.5. | Patterning and metallization: Flexible PCBs |
3.6. | Component attachment materials: Rigid PCBs |
3.7. | Component attachment materials: Flexible PCBs |
3.8. | Materials for integrated circuits (i) |
3.9. | Production of integrated circuits (ii) |
4. | EMERGING SUSTAINABLE MANUFACTURING METHODS OF PRINTED CIRCUIT BOARDS |
4.1. | PCB manufacturing: Chapter structure |
4.1.1. | Introduction: History of traditional PCBs |
4.1.2. | Conventional PCB manufacturing |
4.1.3. | Manufacturing of PCBs concentrated in APAC |
4.1.4. | Key areas for sustainability within PCBs |
4.1.5. | Sustainable materials for PCB manufacturing |
4.2. | PCB Design Options |
4.2.1. | Introduction: Design options for PCBs |
4.2.2. | Double-sided and multi-layered PCBs allow extra complexity and reduce board size |
4.2.3. | Flexible PCBs require new innovation |
4.2.4. | Moving away from rigid PCBs will enable new applications |
4.2.5. | An introduction to in-mold electronics |
4.2.6. | IME manufacturing process flow |
4.2.7. | Motivation and challenges for IME |
4.2.8. | How sustainable is IME? |
4.2.9. | IME can reduce plastic usage by more than 50 % |
4.2.10. | Key takeaways: PCB design options |
4.3. | Substrate Choices |
4.3.1. | Introduction: Substrate choices |
4.3.2. | FR4 uses toxic halogenated substances |
4.3.3. | Legislation on halogenated substances is becoming more restrictive |
4.3.4. | Halogens pose significant health and safety threat as electronics become smaller |
4.3.5. | Halogen-free FR4 presents numerous advantages |
4.3.6. | Household names adopting low or halogen-free technology |
4.3.7. | HP working with Clariant to develop halogen-free electronics from recycled materials |
4.3.8. | SWOT Analysis: Halogen-free FR4 |
4.3.9. | Bio-based printed circuit boards |
4.3.10. | Switching to bio-based PCBs involves new optimization |
4.3.11. | Challenges facing bio-plastics |
4.3.12. | Polyimide is the leading non-FR4 alternative |
4.3.13. | Application areas for flexible (bio) polyimide PCBs |
4.3.14. | (Bio)polyimide could be the material of the future for flexible electronics |
4.3.15. | PET is much more cost-effective than PI |
4.3.16. | Jiva has developed the first fully recyclable bio-based PCB |
4.3.17. | Microsoft working on sustainable PCBs |
4.3.18. | Dell's Concept Luna laptop using flax-based PCBs |
4.3.19. | Paper-based PCBs could be an environmentally friendly and low-cost solution |
4.3.20. | Arjowiggins printing circuits onto paper |
4.3.21. | SWOT Analysis: Bio-based materials |
4.3.22. | Market status of FR4 alternatives |
4.3.23. | Innovation opportunities for FR4 alternatives |
4.3.24. | Sustainability index: PCB substrates |
4.3.25. | Key takeaways: FR4 alternatives |
4.4. | Patterning and Metallization |
4.4.1. | Introduction: Patterning and metallisation |
4.4.2. | Conventional metallization is wasteful and harmful |
4.4.3. | Common etchants pose environmental hazards |
4.4.4. | Etchant regeneration could make wet etching more sustainable |
4.4.5. | Dry phase patterning removes sustainable hurdles associated with wet etching |
4.4.6. | Print-and-plate could revolutionize PCB manufacturing |
4.4.7. | Sustainability benefits of print-and-plate |
4.4.8. | Print-and-plate for in-mold printed circuits |
4.4.9. | Laser induced forward transfer (LIFT): Combining the best of inkjet and laser direct structuring |
4.4.10. | Operating mechanism of laser induced forward transfer (LIFT) |
4.4.11. | Target applications for laser induced forward transfer |
4.4.12. | Copper inks more sustainable and cost-effective than silver |
4.4.13. | Copper inks with in-situ oxidation prevention |
4.4.14. | Formaldehyde alternative for green electroless plating |
4.4.15. | Innovation opportunities for patterning and metallisation processes |
4.4.16. | Sustainability index: Patterning and Metallisation Processes |
4.4.17. | Sustainability index: Patterning and Metallisation Materials |
4.4.18. | Key takeaways: Patterning and metallization |
4.5. | Component Attachment Materials and Processes |
4.5.1. | Introduction: Component attachment materials |
4.5.2. | Comparing component attachment types |
4.5.3. | Introduction: Limitations of conventional lead-free solder |
4.5.4. | Low-temperature soldering and adhesives reduces energy and enables new technology |
4.5.5. | Low temperature solder alloys |
4.5.6. | Low temperature solder enables thermally fragile substrates |
4.5.7. | Substrate compatibility with existing infrastructure |
4.5.8. | Low temperature solder could perform as well as conventional solder |
4.5.9. | Low temperature solder may increase cost per PCB by extending reflow times |
4.5.10. | SAFI-Tech's innovative supercooled liquid solder |
4.5.11. | SWOT Analysis: Low temperature solder |
4.5.12. | Electrically conductive adhesives - a component attachment material for fully flexible electronics? |
4.5.13. | Key ECA innovations reduce silver content |
4.5.14. | ECAs in in-mold electronics (IME) |
4.5.15. | ECA curing may be more energy efficient than low temperature solder reflow |
4.5.16. | SWOT Analysis: ECAs |
4.5.17. | Market readiness of different solders and ECAs |
4.5.18. | ECAs vs low temperature solder |
4.5.19. | Innovation opportunities: Component attachment materials |
4.5.20. | Sustainability index: Component attachment materials |
4.5.21. | Key takeaways: Component attachment materials |
4.5.22. | Introduction: Curing and reflow processes |
4.5.23. | Thermal processing can be slow and time consuming |
4.5.24. | UV curing of ECAs could lower heat |
4.5.25. | Photonic sintering/curing could enable cheaper production and reduce factory size |
4.5.26. | Near-infrared radiation can dry in seconds |
4.5.27. | Market readiness of component attachment processes |
4.5.28. | Sustainability index: Component attachment processes |
4.5.29. | Key takeaways: Component attachment processes |
4.6. | End of Life - Disposal and Recycling |
4.6.1. | Introduction: End of life |
4.6.2. | Etchant produces largest amount of hazardous waste |
4.6.3. | Recovery of copper oxide from waste water slurry is effective but inefficient |
4.6.4. | Print-and-plate could save PCB industry 200 million litres of water annually |
4.6.5. | VTT's life cycle assessment of in-mold electronics |
4.6.6. | IME vs reference component kg CO₂ equivalent (single IME): Cradle to gate |
4.6.7. | IME vs reference component kg CO₂ equivalent (10,000 IME panels): Cradle to grave |
4.6.8. | Summary of VTT's life cycle assessment |
4.6.9. | Key takeaways: End of life |
5. | SUSTAINABLE INNOVATION WITHIN INTEGRATED CIRCUITS |
5.1. | IC manufacturing: Chapter structure |
5.1.1. | Conventional integrated circuit manufacturing |
5.1.2. | Key areas for sustainability within IC manufacturing |
5.2. | Wafer Production |
5.2.1. | Introduction to wafer production for ICs |
5.2.2. | Conventional silicon wafer production |
5.2.3. | Ingot sawing costs industry billions in lost silicon and wasted energy |
5.2.4. | Innovation within the silicon PV industry could benefit integrated circuits |
5.2.5. | Gallium nitride is more sustainable and lower cost than silicon |
5.2.6. | Gallium nitride not susceptible to chip shortage concerns |
5.2.7. | SWOT analysis: Gallium nitride ICs |
5.2.8. | PragmatIC developing thin film alternatives to silicon with 1000x lower embedded energy |
5.2.9. | SWOT analysis: PragmatIC's flexible ICs |
5.2.10. | Fully printed organic ICs are in early stage development |
5.2.11. | SWOT analysis: Organic ICs |
5.2.12. | Sustainability index: Wafer production |
5.2.13. | Key takeaways: Wafer manufacturing |
5.3. | Oxidation |
5.3.1. | Introduction to oxidation |
5.3.2. | Recycling acid etchants reduces highly toxic waste and increases supply chain security |
5.3.3. | Thinner gate oxides reduce time and energy consumption during oxidation |
5.3.4. | Metal oxides could replace silicon oxide in the future |
5.3.5. | Solution-based hafnium oxide could reduce fabrication time |
5.3.6. | Market readiness of oxide options |
5.3.7. | Sustainability index: Oxidation |
5.3.8. | Key takeaways: Oxidation |
5.4. | Patterning and Surface Doping |
5.4.1. | Introduction: Patterning and surface doping |
5.4.2. | Wet chemical etching is the most conventional method but wasteful |
5.4.3. | Dry (plasma) etching could provide long-term savings and reduce toxic waste |
5.4.4. | Nano OPS' 'fab in a tool' could cut IC costs by 2 orders of magnitude |
5.4.5. | Surface doping - room for improvement? |
5.4.6. | Sustainability index: Patterning |
5.4.7. | Key takeaways: Patterning and doping |
5.5. | Metallization |
5.5.1. | Introduction: Metallization |
5.5.2. | The return of metal gates may increase costs |
5.5.3. | Due diligence restrictions on tantalum sourcing imposed by EU policy |
5.5.4. | Printed metal gates for organic thin film transistors |
5.5.5. | Physical vapour deposition may be the best choice for copper interconnects |
5.5.6. | Sustainability index: Metallization |
5.5.7. | Key takeaways: Metallization |
5.6. | End of Life |
5.6.1. | Introduction: End of life |
5.6.2. | One third of emissions from the electronics industry are produced by integrated circuits |
5.6.3. | Increasing renewable energy can result in substantial emissions reductions |
5.6.4. | Early testing minimizes waste |
5.6.5. | Water conservation increasing among major players |
5.6.6. | Samsung operating global take-back schemes |
5.6.7. | Key takeaways: End of life |
6. | COMPANY PROFILES |
6.1. | Alpha |
6.2. | Altana |
6.3. | CondAlign |
6.4. | DP Patterning |
6.5. | Elephantech |
6.6. | imec |
6.7. | Intel |
6.8. | IOTech |
6.9. | Kieron |
6.10. | NanoOPS |
6.11. | PragmatIC |
6.12. | SAFI-Tech |
6.13. | Samsung |
6.14. | Sunray Scientific |
6.15. | TactoTek |
6.16. | TSMC |
6.17. | VTT |
6.18. | In2tec |