Webinar: Advancement in 2.5D & 3D Semiconductor Packaging Technologies

Webinar Title: Advancement in 2.5D and 3D Semiconductor Packaging Technologies

Date: Wednesday 17 January 2024

Presenter: Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx

 

 

Semiconductor packaging has progressed from 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving single micronmeter level interconnecting pitches and over 1000 GB/s bandwidth. Key parameters include Power, Performance, Area, and Cost. Power efficiency improves through innovative packaging, while Performance benefits from shortened interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor. Cost reduction involves material alternatives and enhanced manufacturing efficiency. In 2.5D, interposers include Si-based, organic-based, and glass-based options. In 3D, microbump technology evolves for smaller pitches, with the current single-digit micronmeter pitch achieved through hybrid bonding, a groundbreaking Cu-Cu connection method.

 

In this webinar, Senior Technology Analyst Dr. Yu-Han Chang will present IDTechEx's latest research findings for the advanced semiconductor packaging industry, which will include research from IDTechEx's new market research report: "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications".

 

This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies and the content include:

 

 

Date: Wednesday 17 January 2024

Duration: Approx. 30 Minutes

 

Please click here to check timings and register for your specific time zone.

 

If you are unable to make the date, please register anyway to receive the links to the on-demand recording (available for a limited time) and webinar slides as soon as they are available.