Dr Yu-Han Chang Senior Technology Analyst
Bio:
Dr Yu-Han Chang is a Senior Technology Analyst at IDTechEx working predominantly on advanced materials.
Dr Chang previously worked as an Etching Process Engineer in Taiwan Semiconductor Manufacturing Company (TSMC) from 2012-2014, where she gained experience of working with 16 nm to 40 nm technology.
Education:
Yu-Han has a PhD in Chemistry from Imperial College London. Her research was focused on charge carrier dynamics of Cu(In,Ga)Se2 (CIGS) thin-film solar cells utilizing transient absorption spectroscopies. Her PhD work resulted in two first-author publications in the top 2% journals in the field of materials science: Advanced Energy Materials and Advanced Functional Materials.
She obtained her master's and bachelor's degree in Materials Science and Engineering at the National Tsing-Hua University in Taiwan. Her master research focused on synthesizing Indium sulphide non-toxic layer for CIGS thin-film solar cells.
Previous Research:
Yu-Han has a total of 8 years of experience working with semiconductor and photovoltaic materials. She has also acted as an associate consultant for a London renewables start-up and evaluated the investment potential of expanding their business to SE Asia.
Yu-Han enjoys organizing STEM outreach activities, promoting science and renewable energies to the general public. She held 4 outreach events at Imperial College London and Science Museum London during her PhD and acted as an ambassador for many more.
Speaking at Forthcoming Events
MicroTech 2024
Bristol - 10 Apr 2024
MicroTech 2024 is the Annual IMAPS-UK Conference which will focus on Is Advanced Packaging Ready for Take Off?. This In Person Conference combines invited Keynotes and presentations from leading Industrial Companies and Research Organisations. The Conference will also include the IMAPS-UK Annual General Meeting (AGM).
IDTechEx Senior Technology Analyst Dr Yu-Han Chang is speaking in the conference.
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Recent Work
Research Articles
- Next-Gen 2.5D & 3D Semiconductor Packaging: Dielectric Material Trends
- Advancing Integration in Antenna Packaging Technologies for 5G and 6G
- Advanced Semiconductor Packaging Trends in AI and HPC
- Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights
- High Performance Computing for Automotive
Reports Authored
- Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets
- Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts
- Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications
- Software-Defined Vehicles, Connected Cars, and AI in Cars 2024-2034: Markets, Trends, and Forecasts
- EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications