Semiconductors, Computing & AI - IDTechEx Reports and Subscriptions

The report delves into the thermal management strategies employed in electric vehicle (EV) power electronics. It encompasses various aspects such as the thermal architecture within EV power semiconductor packaging, the materials (e.g., solder, silver sinter, copper sinter, etc.) utilized for die and substrate attachment, thermal interface materials, as well as cooling methods involving air, water, and oil. A thorough technological examination of die attach, substrate attach, and thermal interface materials (TIMs) utilized in SiC MOSFETs, Si IGBTs, and GaN technologies. It also provides market forecasts for TIMs in the EV power industry categorized by technology (Si, SiC, GaN) and component (Inverter, Onboard Charger, and DC-DC Converter). A number of commercial use cases are included in the report. With historical market data spanning from 2021 to 2023 and future projections extending from 2024 to 2034, this study offers a comprehensive understanding of thermal management in the EV power electronics sector. It underscores significant growth prospects, with the total market value of TIMs anticipated to surpass US$900 million by 2034.

Quantum computing promises a revolution in computational capabilities. This accessible quantum computing market report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing quantum computer technologies are assessed: superconducting, silicon-spin, photonic, trapped-ion, neutral-atom, topological, diamond-defect, and annealing. Detailed SWOT analysis, company roadmaps, and benchmarking are provided for each modality, along with twenty-year market forecast outlining the prospects of each.

IDTechEx's brand new report, "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets," delves into AiP technologies for 5G mmWave and 6G, focusing on various substrate types and packaging methods. It also explores antenna integration for beyond 100 GHz applications, showcasing case studies and addressing challenges. Drawing on IDTechEx's expertise, the report offers valuable insights into the evolving landscape of antenna packaging for future generations of wireless technology.

Materials Informatics represents an R&D paradigm shift by fundamentally accelerating the time from innovation to market. It represents the digital transformation of the materials industry, with AI driving material development. There are multiple strategic approaches and many notable success stories; missing this transition will be costly. This report provides key insights into the market, forecasting its growth to 2034. Readers will get a detailed understanding of the players, business models, technology, and the application areas. Over 30 company profiles are included, giving primary insights into this fast-evolving industry.

This report provides critical market intelligence about quantum communication technology. This includes an overview of the emerging quantum computing to data security and solutions offered by quantum random number generators (QRNG) and quantum key distribution (QKD). There is global coverage of trends in the quantum communication market, including comparison with post-quantum cryptography (PQC). This comprehensive study includes over 25 company profiles, and market forecasts for 2024-2034. The quantum communications market is predicted to grow significantly, with a CAGR of 28%.

IDTechEx's "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications" report explores the dynamic semiconductor packaging landscape, emphasizing 2.5D and 3D packaging. It analyzes technology trends, industry barriers, and the progress of key players, forecasting market trends. Leveraging IDTechEx's expertise in AI, data centers, autonomous vehicles, 5G, and consumer electronics, the report offers a comprehensive understanding of how advanced semiconductor packaging shapes these sectors, providing valuable insights into the industry's future.

The automotive radar market is well established within the overall automotive market. However, it still has room to grow as advanced driving assistance system (ADAS) feature continue to grow in adoption. The pursuit of higher levels of autonomous driving also demands higher performance from radar, with longer ranges and higher resolution needed. As such 4D imaging radars are now coming to the market. Use this report to understand the latest developments in radar technology, identify opportunities within the market, and see how radar technology is set to grow and evolve over IDTechEx's 20-year forecast.

This report characterizes the edge AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2034) across 6 different areas (therein 3 primary regional geographies, consumer and enterprise use, 5 device architectures (GPUs, CPUs, ASICs, DSPs and FPGAs), 3 device packaging types, 3 application areas, and 7 industry verticals) - along with surveys of key edge applications for AI including smartphones, tablets, and automotive - make this the most comprehensive study compiled for AI processors and accelerators at the edge. This report reveals significant opportunity in various parts of the edge AI chip landscape, with the edge AI chip market forecast to grow to over US$22 billion by 2034.

'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.

This comprehensive report draws on IDTechEx's extensive knowledge and experience in the field, offering valuable insights into materials and processing techniques used in advanced semiconductor packaging. It covers crucial technology trends, including the 2.5D packaging process flow and the innovative Cu-Cu hybrid bonding technology for 3D packaging. Additionally, the report provides a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presenting projections for unit and area metrics.

This report analyzes air cooling, cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolant fluids, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center IT capacity based on insights from industry leaders, and outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.

This report characterizes the AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2033) across 6 different areas (therein 3 primary regional geographies, edge and cloud processing types, 4 device architectures (GPUs, CPUs, ASICs and FPGAs), 3 device packaging types, 4 application areas, and 9 industry verticals), along with one-of-a-kind calculations pertaining to the design, manufacture, ATP, and operation of leading-edge AI chips, make this the most comprehensive study compiled for this AI processors and accelerators. This report reveals significant opportunity in various parts of the AI chip landscape, with the AI chip market forecast to grow to over US$250 billion by 2033.

This report provides holistic and deep coverage of semiconductor usage for a new era of vehicles. Understand the key trends within enabling technologies such as radar, LiDAR, cameras, inverters, battery management systems, MCUs and SOCs and how they impact future semiconductor demand. The report's granular 10-year forecasts include semiconductor wafer demand, semiconductor material demand including Si, SiC, GaN, InGaAs and more, as well as revenue through wafer production in US$.

Semiconductor photonics at the chip-scale is reviewed, with revenue forecasts given for six key markets. Forecasts are disaggregated by specific applications, material platforms (including silicon and indium phosphide), and geography. We show that the semiconductor photonics industry will not reach saturation by 2033, and is growing at an impressive rate. Semiconductor photonics is the best candidate for achieving increasingly high data rate transmissions, over increasingly long distances.

5G deployment is in full swing with continued deployment of infrastructure and 5G compatible devices. However, there are still many challenges to address with many material level challenges around thermal management. This report considers the evolution of 5G antenna design and components to analyse trends in semiconductor technology, the associated die attach materials, power supplies and thermal interface materials. Current and emerging technologies are described along with forecasts across these categories through to 2032.

Electrically conductive adhesive (ECAs) are a competitor to solder. ECAs are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mold electronics, and wearable technologies. This report includes key insights and commercial outlooks for the global electrically conductive adhesive market. The report considers electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs). 10-year ECA market forecasts are given for each application area.

Artificial intelligence (AI) is emerging as a technology that can solve longstanding problems in drug development, including drug discovery. This report highlights the key machine learning and deep learning technologies (architectures and algorithms), companies, and applications driving billion-dollar investments and deals between the biopharma industry and AI drug discovery start-ups. AI will significantly accelerate drug discovery timelines and introduce substantial cost savings for the biopharma industry.

This report explores the field of image recognition artificial intelligence (AI) for disease detection by breaking down its five main clinical applications. It describes emerging technologies, highlights key players and analyses market landscape for each sector. Trends, opportunities, threats and challenges (both technical and commercial) are discussed at length, thereby providing detailed insights into the current and future market for this technology.

This report serves as both a primer into the field of digital health, summarizing the findings across telehealth/telemedicine, remote patient monitoring (including diabetes management technologies), digital therapeutics, consumer health wearables, and AI in medical imaging diagnostics. The report provides profiles of over 135 companies active in the field, a detailed 10-year forecast of over 19 types of RPM technologies, and a 40-year outlook on the uptake of AI in imaging diagnostics across 13 therapeutic areas.

IDTechEx's report 'EMI Shielding for Electronics 2024-2034' explores the competing strategies and materials for protecting sensitive electronic components. It covers the transition from board to package level shielding, and from sputtering to spraying/printing. Players and opportunities are evaluated, and demand for EMI materials across multiple application sectors are forecast.

This report characterizes the quantum sensor markets, technologies, and players. Coverage across 17 quantum sensing technology areas, major applications in electric vehicles, navigation, medical imaging and quantum computing with market forecasts from 2024 to 2044. It reveals significant opportunity, with the quantum sensor market forecast to peak at US$7.1bn by 2044.

IDTechEx has been studying telecommunication technologies for many years and we have just released our latest version of the 6G market research report "6G Market 2023-2043: Technology, Trends, Forecasts, Players". This report is built on our expertise, covering the latest 6G technology development trend, key applications, player activities, and market outlook. Key aspects in this report include THz technologies trend, semiconductors for THz communication, THz phase array antenna modules, 6G radio analysis, low-loss materials, packaging trend for 6G, reconfigurable intelligent surfaces (RIS), Metamaterials, Non-terrestrial networks, integrated sensing and communication, 6G market, and future outlook.

The report assesses sustainable methods of electronics manufacturing. It evaluates how sustainable innovations within printed circuit boards and integrated circuits can drive forward a new era of electronics. Featuring granular market forecasts, the report covers different materials and manufacturing processes that can deliver environmental improvements in a way that is scalable and cost-effective. IDTechEx expects that within a decade, 20% of PCBs could be manufactured using more sustainable methods.

The future of solar technology extends far beyond silicon, with numerous alternative materials that belong to a certain class called 'thin film'. These can deliver several unique advantages such as higher efficiency indoor energy harvesting, simpler manufacturing, and potentially lower costs than conventional silicon PV. A particularly exciting opportunity is their role in powering Internet of Things devices - a rapidly growing market following the increasing smartification of home and retail electronics.

Perovskite photovoltaics have already demonstrated remarkable efficiencies, with new applications enabled by their low cost, thin film architecture and tuneable absorption. This IDTechEx report explores the suitability and market opportunities of perovskite PV as well as the innovation opportunities and barriers to entry. It evaluates methods to resolve the main challenge of stability, as well as manufacturing methods and requirements for speciality materials.